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  • Grasshopper3 USB3 (Legacy)

    The Grasshopper®3 camera line provides high-performance, high-quality imaging by combining FLIR expertise with the latest in CCD and CMOS technology.

  • Xtium Family

    The Xtium series delivers higher bandwidth to sustain Camera Link 80-Bit modes over longer cable distances and supports a wide variety of area and line scan color and monochrome cameras, all in a compact, single slot solution.

  • InAs TE Cooled

    For applications demanding even greater thermal control and low-noise performance, Teledyne Judson’s TE-cooled InAs detectors are the ideal solution. With a 3.8 μm cut-off and photovoltaic operation, they deliver exceptional sensitivity for DC and low-frequency measurements – without the 1/f noise seen in photoconductive alternatives.

  • BOA Spot (Legacy)

    Everything you expect in a vision system for less. With integrated LED lighting, lens cover, easy-to-use software, and easy integration with factory systems.

  • Evaluation Kit for Dragonfly S Cameras

    Leverage the Evaluation kit to get you started with your design journey. Plus, create up to 7 different camera configurations as needed, all on your own.

    The Dragonfly S Evaluation Kit is meant for use with CS- or C-mount models. Camera is not included.

    The evaluation kit includes:
    USB3, 3 meter, Type A-male to Micro-B (Horizontal Locking) Cable (ACC-01-2300)
    Dragonfly S Universal Locking Bracket (ACC-01-0020)
    0.3 m 6-pin JST Connector GPIO Cable (ACC-01-3015)
    M12 S-mount lens (ACC-01-4007)
    CS- to C-mount 5 mm Spacer Adapter (ACC-01-5004)
    Tripod Adapter (ACC-01-0017)
    Dragonfly S S-mount Front
    Two Dragonfly S Thermal Pads
    Heatsink - required for board-level and partial case configurations.
    Hex key

    Items in the kit identified with part numbers can also be purchased separately.

  • PV MCT LN2 Cooled

    Optimized for low-noise performance, these detectors are LN₂-cooled to significantly reduce dark current and enhance detectivity. Ideal for demanding spectroscopy and thermal imaging applications, they feature high shunt resistance, low capacitance, and are available in various active area sizes and configurations.

  • PV MCT TE Cooled

    Thermoelectrically cooled detectors offering high sensitivity, low noise, and fast response across a wide 2.8–5.0 μm spectral range. Available in one- to four-stage TE configurations, these sensors provide enhanced performance for applications requiring precision and stability.

  • Genie Nano-CXP

    Genie Nano-CXP builds on Nano's proven reputation and leverages a CoaXPress 6Gbps interface to deliver maximum throughput from leading edge CMOS image sensors.

  • LT Series Board Level

    The Lumenera LT Series USB3 Board Level Cameras offer a smaller, lighter, and lower cost imaging solution.

  • BOA3 (Legacy)

    Introducing BOA3, Teledyne DALSA’s fastest, most flexible smart camera platform. BOA3 is a highly integrated vision system in a compact smart camera format.

  • GEVA 3000 CL (Legacy)

    GEVA 3000 CL multicamera vision systems adds Camera Link support to Teledyne DALSA's high-performance industrial controllers with embedded software, offering excellent cost savings for vision applications such as final inspection of large assemblies

  • Rad-icon

    Teledyne’s Rad-icon family digital x-ray panels offer large area and high performance with a fast, reliable PC interface (either GigE or CameraLink)