Teledyne Vision Solutions to Showcase Semiconductor Inspection Technologies at SEMICON Europa 2026
WATERLOO, Canada, October 27, 2026 – Teledyne Vision Solutions will showcase advanced imaging technologies for semiconductor inspection at SEMICON Europa 2026, taking place November 10-13, 2026, at Messe München in Munich, Germany. Visitors can see live demonstrations of the Linea™ ML 32K line scan camera and Z3™ 3D Measurement System in Hall C2, Stand 136.
The Linea ML 32K demonstration will show how a 300 mm semiconductor wafer can be inspected in a single pass at 10 µm resolution. As the world's first true 32K line scan camera, Linea ML 32K combines 32K resolution, 2.5 µm pixels, and imaging speeds of up to 150 kHz to deliver exceptional image quality and defect detection performance. Built on Teledyne's proven Linea platform, the camera also supports advanced imaging modes, including multiline operation, HDR, and TDI, helping manufacturers improve inspection confidence while simplifying integration into existing systems.
Teledyne will also demonstrate the Z3 3D Measurement System, which combines high-resolution 3D measurement and 2D imaging for precision inspection and metrology. With up to 1.25 µm spatial resolution, up to 35 nm height repeatability, and throughput of up to two seconds per wafer, the Z3 supports demanding semiconductor inspection and measurement applications at in-line speeds. Designed to support the leading-edge AI hardware needs, the latest 3D measurement system supports micro BGA, bump and pillar metrology on die, wafer, or stretch frame, as well as TGV/TSV, wafer inspection, wafer-to-wafer bonding, flatness, coplanarity, and defect analysis. The Z3 delivers detailed surface and dimensional measurements to support process control and quality assurance.
Visitors are invited to stop by Hall C2, Stand 136 to speak with Teledyne imaging specialists and learn more about the company's solutions for semiconductor inspection and measurement.
About Teledyne Vision Solutions
Teledyne Vision Solutions offers the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Aligned under one umbrella, Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics, and Adimec form an unrivalled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest sensing and related technology portfolio in the world. Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.
Media Contact
Farhad Kazi; [email protected]