Teledyne Adimec’s DIAMOND UV camera series offer an off-the-shelf solution solution for the most demanding in-line inspection applications that require high sensitivity below 400 nm wavelengths. The combination of advanced image sensors and the CoaXPress interface improves accuracy and throughput of semiconductor inspection systems. Superior image performance is ensured through efficient heat dissipation in the camera design and a precisely calibrated non-uniformity correction.
Specifications
Highlighted
- Megapixels
- 8
- Max Frame Rate Standard
- 190
- Sensor Type
- CMOS
- Data Interface
- CoaXPress – CXP 3/6/12 (1 or 2 lanes configurable)
Features
- Acquisition Modes
- Continuous or controlled
- High Dynamic Range
- No
Performance
- Digitization Bit depth
- 8-bit, 10-bit, 12-bit
- Dynamic Range
- ≥ 69.6 dB
- Full Well Capacity (Qsat)
- 8.5 ke-
Physical
- Connector
- 2 x Micro-BNC
- Dimensions [W x H x L]
- 44.5 mm x 44.5 mm x 23.3 mm
- GPIO
- Phoenix Contact 12 pin SACC-DSI-M12FS-12CON-M16
- Mass
- 91 g
- Operating Humidity
- 20% - 80% non-condensing
- Sensor Temperature
- +5°C to +60°C
- Storage Humidity
- 5% - 95% non-condensing
- Storage Temperature
- -25°C to +65°C
Compliance & Certifications
- Compliance
- ROHS, ESD, Workmanship
