Teledyne Adimec’s DIAMOND UV camera series offer an off-the-shelf solution solution for the most demanding in-line inspection applications that require high sensitivity below 400 nm wavelengths. The combination of advanced image sensors and the CoaXPress interface improves accuracy and throughput of semiconductor inspection systems. Superior image performance is ensured through efficient heat dissipation in the camera design and a precisely calibrated non-uniformity correction.
Specifications
Highlighted
- Megapíxeles
- 8
- Tipo de sensor
- CMOS
- Interfaz de datos
- CoaXPress – CXP 3/6/12 (1 or 2 lanes configurable)
Características
- Modos de adquisición
- Continuous or controlled
- Rango dinámico alto
- No
Rendimiento
- Capacidad total de pozo por pixel (Qsat)
- 8.5 ke-
- Profundidad de bit de digitalización
- 8-bit, 10-bit, 12-bit
- Rango dinámico
- ≥ 69.6 dB
Físico
- Conector
- 2 x Micro-BNC
- Dimensiones (An. × Al. × L.)
- 44.5 mm x 44.5 mm x 23.3 mm
- GPIO
- Phoenix Contact 12 pin SACC-DSI-M12FS-12CON-M16
- Humedad de almacenamiento
- 5% - 95% non-condensing
- Humedad operativa
- 20% - 80% non-condensing
- Masa
- 91 g
- Temperatura de almacenamiento
- -25°C to +65°C
- Temperatura del sensor
- +5°C to +60°C
Cumplimiento y certificaciones
- Conformidad
- ROHS, ESD, Workmanship
