Linea HS2
Teledyne DALSA’s new Linea HS2 camera represents another breakthrough in next generation TDI technology. Designed for ultra high speed imaging in light starved condition, this camera offers superior image quality with 8k or 16k resolution at a max line rate 1MHz. It has dual CLHS data interface that achieves 16GB/s data throughput with field-proven reliability in high-speed data transmission.
A Seamless Upgrade, Packed with Powerful Features
Linea HS2 offers an easy upgrade from Teledyne’s existing Linea HS line scan cameras, featuring the same pixel size, optics, cables, and mounting hardware, but with a 2.5 time increase in speed, while maintaining reasonable power consumption. The cameras also deliver the highest performance available, with unique features that significantly improve detectability for many demanding applications.
Backside Illumination for Ultra-High-Speed Imaging
Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 8k or 16k 5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range, or full well, according to specific application requirements. On-chip binning also enables higher web speeds to boost system throughput. The camera is equipped with dual Camera Link HS CX4 connectors to Active Optical Cables providing complete EMI immunity.
A Complete Imaging Solution
For a complete solution, the Linea HS2 camera works with Teledyne’s Xtium3 CLHS series of high-performance frame grabbers, utilizing next generation CLHS technology. The Xtium3 CLHS PX8 is built on reliable, field-proven high-speed data transmission technology, delivering data at 16 Gigapixels per second over dual CLHS CX4 connectors to active optical cables. Its data forwarding capability supports parallel data processing in up to 12 PCs and together with Linea HS2, allows for cable lengths over 100 meters with complete EMI immunity.
Typical Applications
The Linea HS2 enables high speed and high sensitivity imaging in light starved conditions, making it particularly idea for:
- Semiconductor wafer inspection
- High density packaging inspection
- Flat panel display inspection
- Gene sequencing
- Digital pathology
If you need maximum throughput in the toughest conditions, you need Linea HS2.
Family Highlights
| Camera Type | TDI Line Scan |
|---|---|
| Sensor Technology | CMOS |
| Supported Interfaces | Camera Link HS |
| Spectrum Capability | Ultraviolet (350-400 nm), Visible (400-700 nm), Near Infrared (700-1000 nm) |
Model Finder
Results:
| Product | Resolution | Spectrum | Interface | Pixel Size (μm) | Max Line Rate | Status | Compare |
|---|---|---|---|---|---|---|---|
Linea HS2 16k 1MHz BSIH2-HM-16K100H-00-B |
16384 x 288 (3 TDI arrays 128 + 128 + 32) | Mono | Camera Link HS | 5 | 1000 kHz | In Production Request Info |
|
Linea HS2 8k BSI 1MHzH2-HM-08K100H-00-B |
8192 x 288 (3 TDI arrays 128 + 128 + 32) | Mono | Camera Link HS | 5 | 1000 kHz | In Production Request Info |
|
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Resources & Support
Article
Photonics Spectra Article - Multifield Imaging Enhances Detectability at Speed
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Below are assets shared by all models of this product family.
For model-specific assets, select an option in the Model Finder above.
Linea HS2 8k and 16k Camera Datasheet
Linea HS2 Application Note: Binning Sensor Vertical Mode (BSV)
Linea HS2 Declaration of Conformity
Linea HS2 Material Composition Product Declaration
Linea HS2 User Manual