For 20 years, our Teledyne AnaFocus team has partnered with a fast growing portfolio of new customers to co-develop a range of truly innovative custom CMOS image sensors.
Teledyne AnaFocus image sensors are tailored to optimally solve specific customer application challenges with 95% of projects successful in their first silicon (an unprecedented industry track record).
Ultra-high speed image sensors, delivering millions of frames per second.
Ultra-low noise, high sensitivity sensors with specifications rivalling EMCCDs.
3D sensors which improve the speed and accuracy of pre-existing solutions.
High-sensitivity, low-noise time-of-flight sensors with automotive and industrial grade.
Highly integrated vision sensors for industrial use.
Line scan solutions with performance comparable to TDI CCDs.
From standard to fully custom products, to fit all of your needs.


1D

2D

3D


Design and Production Capabilities

From wafers to integrated systems 65nm, 180nm fab processes

Supply Chain

From hundreds to
> 2 million units a year

Image Sensor Size

Linear up to 32K
Area up to 67M

Pixel Pitch

From 1.12 µm to 10 x 200 µm

Speed

From 30 to 3 million fps

Spectral Range

From X-ray, visible to NIR*


*NIR: a unique photodiode and process exclusive to Teledyne e2v

Shuttering Modes

3T, 4T, 5T, 6T and rolling or global shutter

Sensor Packing Options

CLCC, PGA, COB, (CSP, Fan-out)

Interfaces: From Sensor to Sub-system


SP1/12C


USB 2

USB 3


Other Functionalities

Multiple ROI
Binning
Subsampling
Gating for ToF or range gating
Ultra low noise
HDR mode
Single photon sensitivity
FPN & defective pixel correction
Stitching
Low light, BSI