Key Specs
- Wavelength
- Frame Rate
- Sensor
- 400 nm to 1700 nm
- 92 FPS
- Sony IMX990-AABJ (TECless), InGaAs, 1/2"
Extended Spectral Range
Capture images from visible light to SWIR (400 nm to 1700 nm) and enhance detection and analysis across various materials and applications.
Compact and Balanced Design
The compact housing balances image performance and size. It is ideal for space-constrained environments without compromising image quality.
GigE Performance and Reliability
GigE driver performance with the Spinnaker® SDK, Sapera™ Processing, and a powerful Trigger-to-Image Reliability (T2IR) framework.
What is SWIR?
Short-Wave Infrared (SWIR) imaging operates just beyond visible light in the 900 nm to 1700 nm wavelength range. Unlike visible light, SWIR can penetrate materials such as silicon, plastics, and fabrics to varying degrees to reveal details that are otherwise hidden. This makes SWIR technology ideal for a variety of industrial applications where precise material detection and quality inspection are critical.
Benefits of SWIR
Enhanced Material Detection:
Identify and differentiate materials by their unique spectral signatures and detect moisture, chemical composition, and thermal properties with high precision.
Improved Visibility in Challenging Conditions:
The new camera provides superior image clarity and contrast in low light, fog, and through opaque materials. This makes it ideal for applications in hot and steamy environments, hazy outdoor conditions, and in medical diagnostics.
Non-Destructive Testing and Quality Control:
The Forge 1GigE SWIR camera enables non-destructive testing which allows for the inspection of internal structures without damaging the object. This is crucial for industrial quality control and food sorting.
Flexible Application with Narrowband Filters:
Use narrowband filters for specific wavelength imaging to enhance material detection and condition monitoring. This is critical in a diverse range of applications such as agriculture, food production, recycling, scientific research, and industrial inspection.
Application Use Cases
Semiconductor Inspection
High precision and detailed imaging for detecting defects and variations
Food Sorting
Enhanced detection of moisture content, bruises, and defects in fruits and vegetables
Medical Imaging
Superior imaging capabilities for a variety of medical applications
Material Sorting
Effective identification and sorting of different materials in recycling and manufacturing
On-Camera Features
Factory Pixel Correction:
Improved Image Quality: Correct pixel defects, resulting in superior image quality
Sequencer with Region of Interest (ROI):
Pin-Point Inspection: Enables targeted inspection of individual areas in sequence, optimizing the inspection process for specific regions of interest
Logic Block and Counter:
Precise Control: Provides precise control over image capture triggering, synchronization, and output signals to peripheral devices like light sources, ensuring accurate and timely imaging

Software Support
Spinnaker SDK
Comprehensive tools for image acquisition
Sapera Processing
Advanced image processing capabilities
Integration Options
GigE Vision compliance for easy integration into existing systems with versatile connectivity options
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Specifications
Highlighted
- Codice prodotto
- FG-PGE-13S3S-U-C
- Risoluzione
- 1280 x 1024
- Megapixel
- 1.3
- Max standard frequenza fotogrammi
- 92
- Modello sensore
- Sony IMX990
- Dimensioni pixel
- 5
- Tipo sensore
- InGaAs
- Formato sensore
- 1/2"
- Tipo di otturatore
- Global shutter
- Spettro
- SWIR (400 nm to 1700 nm)
- Attacco per ottica
- C-mount
- Sincronizzazione
- Software trigger, hardware trigger, action command, PTP
- Interfaccia dati
- Gigabit Ethernet 1 Gbps
Caratteristiche
- Bilanciamento del bianco
- Manual, automatic (AWB)
- Buffer immagini
- 240 MB
- Controllo del guadagno
- Manual, Automatic (AGC)
- Elaborazione immagine
- Gamma, lookup table, and sharpness
- Memoria Flash
- 1 MB non-volatile memory
- Modalità di acquisizione
- Continuous, Single Frame, Multi Frame
- Modalità immagine parziale
- Decimation, ROI
- Range di esposizione
- 15 µs to 30 seconds
- Set utente
- 2 user configuration sets for custom camera settings
Prestazioni
- Capacità di saturazione (e-)
- 184780
- Intervallo dinamico dB
- 57
- QE (Mono)
- 63
- Range guadagno
- 0 dB - 42 dB
- Rumore di lettura
- 256
- Soglia di sensibilità assoluta (y)
- 408
Caratteristiche fisiche
- Assorbimento [Massimo]
- 2.9 W
- Connettore
- RJ45 (horizontal locking) | Hirose HR10A-7R-6PB
- Dimensioni [L × A × P]
- 40 mm x 40 mm x 43 mm
- Massa
- 116 g
- Porte I/O non isolate
- 1 bi-directional, 1 input
- Porte I/O opto-isolate
- 1 input, 1 output
- Profondità bit digitalizzazione (ADC)
- 8-bit, 10-bit, 12-bit
- Requisiti di alimentazione
- Power over Ethernet (PoE); or 12 V nominal (9.5 - 24 V)
- Temperatura di esercizio
- 0° to 50°C (ambient)
- Temperatura di stoccaggio
- -30°C to 65°C (ambient)
- Umidità di esercizio
- 20 to 80% (no condensation)
- Umidità di esercizio
- 30 to 95% (no condensation)
- Uscita ausiliaria
- 3.3 V, 120 mA maximum
Configurazione di sistema consigliata
- Accessori richiesti
- SWIR Lens, Cable, Host Adapter (GigE)
- Porta
- Gigabit Ethernet Port
Conformità e certificazioni
- Conformità
- CE, FCC, KCC, RoHS, REACH. ECCN is: US ECCN 6A003.b.4.a / Canadian ECL 1-6.A.3.b.4.a
- Garanzia
- 3 years
- Standard di visione artificiale
- GigE Vision v1.2
Media gallery
Resources & Support
News
Teledyne FLIR IIS launches Forge 1GigE SWIR camera series featuring Sony SenSWIR IMX990 sensors
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Spinnaker SDK All Versions for Download
FG-PGE-13S3S-U Package for 2406.1.14.x v1.0 Firmware
Forge 1GigE SWIR Getting Started Manual
Forge 1GigE SWIR Installation Guide
Forge 1GigE SWIR CAD Drawings
FG-PGE-13S3S-U Camera Reference (Release Notes, Specs, EMVA, Dimensions, Features)
FG-PGE-13S3S-U Datasheet
FG-PGE-13S3S-U EMVA Imaging Performance
FG-PGE-13S3S-U Technical Reference
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