Teledyne Adimec’s DIAMOND SWIR camera series offer an off-the-shelf solution solution for the most demanding in-line inspection applications that require high sensitivity above 1000 nm wavelengths. The SWIR image sensors combined with the CoaXPress interface greatly improve the accuracy and throughput of semiconductor inspection systems. Superior image performance is ensured through efficient heat dissipation in the camera design and a precisely calibrated non-uniformity correction optionally combined with TEC cooling of the image sensor.
DIAMOND SWIR cameras are typically used for wafer inspection, semiconductor micro-crack inspection, and semiconductor edge crack analysis.
Specifications
Highlighted
- Resolution
- 1280 x 1024
- Megapixels
- 1.3
- Max Frame Rate Standard
- 150
- Sensor Model
- SCD Cardinal 1280
- Pixel Size
- 10 µm x 10 µm
- Sensor Type
- SWIR
- Spectrum
- SWIR
- Data Interface
- CoaXPress – CXP 3/6 (single lane)
Features
- Acquisition Modes
- Continuous or controlled
- High Dynamic Range
- No
- Removable Cover Glass
- No
- Triggering Modes
- Internal CXP trigger
Performance
- Digitization Bit depth
- 8-bit, 10-bit
- Dynamic Range
- Values disclosed after obtaining an Export License
- Full Well Capacity (Qsat)
- 1 Me-
Physical
- Connector
- 1x DIN1.0/2.3
- Dimensions [W x H x L]
- 44.5 mm x 44.5 mm x 39 mm
- GPIO
- none
- Mass
- 135 g
- Operating Humidity
- 20% - 80% non-condensing
- Operating Temperature
- +5 °C to +40 °C
- Optical Format
- 16.4 mm
- Power Consumption
- Typ. < 4 W
- Power Requirements
- 1 × 24 Vdc PoCXP
- Sensor Shutter Type
- Global Shutter
- Storage Humidity
- 5% - 95% non-condensing
- Storage Temperature
- -25°C to +65°C
Compliance & Certifications
- Compliance
- ESD, Workmanship, MIL-STD-810G
